Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728213 | Method of copper plating filling | Junjie Wang, Minchun Cai | 2023-08-15 |
| 11610981 | Method for manufacturing semiconductor device | Changhung Kung, Xiantao Li, Xiumei Hu, Chanyuan Hu | 2023-03-21 |
| 11581225 | Method for manufacturing semiconductor device | Changhung Kung, Ting Ye, Xiumei Hu, Chanyuan Hu | 2023-02-14 |