Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646272 | Packaging method of panel-level chip device | Kerui Xi, Feng Qin, Xiaohe Li, Tingting Cui | 2023-05-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646272 | Packaging method of panel-level chip device | Kerui Xi, Feng Qin, Xiaohe Li, Tingting Cui | 2023-05-09 |