Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587848 | Forming metal plug through a hole in a device including a resistance layer and contacting embedded conductive structures | Yi-Chun Lu, Yihui Lin, Liang-Wei Wang, Le Li, Kaige Gao +2 more | 2023-02-21 |