Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11616085 | Wiring layer and manufacturing method therefor | Tomoaki Moriwaka, Shinya Sasagawa, Takashi Ohtsuki | 2023-03-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11616085 | Wiring layer and manufacturing method therefor | Tomoaki Moriwaka, Shinya Sasagawa, Takashi Ohtsuki | 2023-03-28 |