Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694945 | Lead frame package having conductive surfaces | Ren Huei Tzeng | 2023-07-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694945 | Lead frame package having conductive surfaces | Ren Huei Tzeng | 2023-07-04 |