Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784146 | Method and apparatus for a ground wire bonding attachment in MMIC devices | Fuad Haji Mokhtar, Goh Chee Kheng, Alvin Yong Shee Meng | 2023-10-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784146 | Method and apparatus for a ground wire bonding attachment in MMIC devices | Fuad Haji Mokhtar, Goh Chee Kheng, Alvin Yong Shee Meng | 2023-10-10 |