Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11805649 | Three-dimensional memory device with wiggled drain-select-level isolation structure and methods of manufacturing the same | Srinivas Pulugurtha, Johann Alsmeier, Yanli Zhang | 2023-10-31 |
| 11587920 | Bonded semiconductor die assembly containing through-stack via structures and methods for making the same | Johann Alsmeier, Koichi Matsuno | 2023-02-21 |
| 11552094 | Three-dimensional memory device having on-pitch drain select gate electrodes and method of making the same | Murshed Chowdhury, Masaaki Higashitani, Johann Alsmeier | 2023-01-10 |