Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842950 | Package module | Yongjin Park, Myungsam Kang | 2023-12-12 |
| 11837537 | Fan-out semiconductor package | Bongju Cho, Myungsam Kang, Gun Lee, Jaekul Lee | 2023-12-05 |
YK
Younggwan Ko
Overall (2023): #92,488 of 537,848Top 20%
2
Patents 2023