Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728268 | Semiconductor devices including via structures having a via portion and a barrier portion | Wonhyuk Hong, Eui Bok Lee, Rakhwan Kim | 2023-08-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11728268 | Semiconductor devices including via structures having a via portion and a barrier portion | Wonhyuk Hong, Eui Bok Lee, Rakhwan Kim | 2023-08-15 |