Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11551944 | Apparatus and method of manufacturing solder bump | Sanghoon Lee, Sungil Lee | 2023-01-10 |
SY
Sungyong Yun
Overall (2023): #239,033 of 537,848Top 45%
1
Patents 2023