Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854948 | Semiconductor package | Byungho Kim | 2023-12-26 |
| 11594488 | Semiconductor package and method of manufacturing the semiconductor package | Byungho Kim | 2023-02-28 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854948 | Semiconductor package | Byungho Kim | 2023-12-26 |
| 11594488 | Semiconductor package and method of manufacturing the semiconductor package | Byungho Kim | 2023-02-28 |