Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11640922 | Gap-fill layers, methods of forming the same, and semiconductor devices manufactured by the methods of forming the same | Chungki Min, Gihwan Kim, Sanghyeok KIM, Hyo Jung Kim, Geunwon Lim | 2023-05-02 |