Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749592 | Package-on-package type semiconductor package including a lower semiconductor package and an upper semiconductor package | Donguk Kwon, Jiwon Shin, Kwangbok Woo | 2023-09-05 |
| 11676904 | Semiconductor package | Jiwon Shin, Donguk Kwon, Kwang Bok Woo | 2023-06-13 |