Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11639438 | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same | Yong Yeop PARK, Dong Hwan Lee, Kyoung Chui Bae, Chui Ho Lee | 2023-05-02 |