Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631798 | Bonding interposer and integrated circuit chip, and ultrasound probe using the same | Dong-Won Shin | 2023-04-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631798 | Bonding interposer and integrated circuit chip, and ultrasound probe using the same | Dong-Won Shin | 2023-04-18 |