Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823995 | Package substrate, and semiconductor package including the package substrate | — | 2023-11-21 |
| 11824043 | Semiconductor package | Hyunjun NOH | 2023-11-21 |
| 11626380 | Semiconductor package | Hyunjun NOH | 2023-04-11 |