Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11678037 | Electronic device including electronic component assembly | Jehyun SON, Dusun Choi | 2023-06-13 |
| 11568949 | Semiconductor package test method, semiconductor package test device and semiconductor package | Hyungsuk Yu, Hyukje Kwon | 2023-01-31 |