Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735553 | Semiconductor package and method of manufacturing the semiconductor package | Sangkyu Lee, Yongkoon Lee | 2023-08-22 |
| 11637079 | Semiconductor package including antenna | Yongkoon Lee, Sangkyu Lee, Seokkyu Choi | 2023-04-25 |
| 11569563 | Semiconductor packages and method of manufacturing semiconductor packages | Yongkoon Lee, Sangkyu Lee | 2023-01-31 |
| 11562939 | Semiconductor package including heat spreader layer | Sangkyu Lee, Yongkoon Lee, Seokkyu Choi | 2023-01-24 |