Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11610786 | Semiconductor package and method of manufacturing semiconductor package | Taeyoung Kim, Seokhong Kwon, Wonyoung Kim | 2023-03-21 |
JA
Jinchan Ahn
Overall (2023): #398,686 of 537,848Top 75%
1
Patents 2023