Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715645 | Method for fabricating semiconductor package | Jung-Ho Park, Jin-Woo Park, Seok Hyun LEE, Gwang Jae Jeon | 2023-08-01 |
JJ
Jae Gwon Jang
Overall (2023): #409,911 of 537,848Top 80%
1
Patents 2023