Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11779232 | Flexible pressure sensor using multi-material 3D-printed microchannel mold and method for manufacturing the same | Kyuyoung Kim | 2023-10-10 |
| 11647586 | Substrate layered structure and interposer block | Sanggeun Kim, Jungtae Seo, Kipoung KIM, Youngjik Lee, Youngkweon KIM | 2023-05-09 |
| 11566959 | Soft pressure sensor using multi-material 3D-printed microchannel molds and method for making the sensor | Kyuyoung Kim | 2023-01-31 |