Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824033 | Semiconductor package and method of manufacturing the semiconductor package | Jinsu Kim, Hyunsuk Yang, Kiju Lee, Hoyeon Jo, Ikkyu Jin | 2023-11-21 |
| 11552038 | Semiconductor package and method of manufacturing the semiconductor package | Jinsu Kim, Hyunsuk Yang, Kiju Lee, Hoyeon Jo, Ikkyu Jin | 2023-01-10 |