Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776918 | Semiconductor package having stiffening structure | Suchang LEE, Yunseok Choi | 2023-10-03 |
| 11664346 | Semiconductor package including semiconductor chips and dummy pad | — | 2023-05-30 |
| 11557543 | Semiconductor package | — | 2023-01-17 |