Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605658 | Bonding interconnection structure of image sensor semiconductor package | — | 2023-03-14 |
DG
Donghoon Gang
Overall (2023): #461,705 of 537,848Top 90%
1
Patents 2023