Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11637019 | Method for forming a semiconductor device having protrusion structures on a substrate and a planarized capping insulating layer on the protrusion structures | Chang Sun Hwang, Han Sol Seok, Hyun Ku Kang, Byoung-ho Kwon | 2023-04-25 |