Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11552062 | Package-on-package (PoP) semiconductor package and electronic system including the same | Tong-suk Kim | 2023-01-10 |
BC
Byeong-Yeon Cho
Overall (2023): #498,127 of 537,848Top 95%
1
Patents 2023