Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11626490 | SiC semiconductor device | Masaya Ueno, Yuki Nakano, Sawa HARUYAMA, Seiya NAKAZAWA, Yasunori Kutsuma | 2023-04-11 |
| 11621319 | SiC semiconductor device | Yuki Nakano, Masaya Ueno, Sawa HARUYAMA, Seiya NAKAZAWA, Yasunori Kutsuma | 2023-04-04 |
| 11610970 | Semiconductor device having a junction portion contacting a Schottky metal | — | 2023-03-21 |