Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11843153 | Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materials | Gokce Gulsoy, Ting Gao, David Bruce Sarraf, Chad William Morgan, Rodney Ivan Martens | 2023-12-12 |