TH

Tsuyoshi Hayasaka

RE Resonac: 1 patents #29 of 157Top 20%
📍 Ibaraki, JP: #146 of 490 inventorsTop 30%
Overall (2023): #220,187 of 537,848Top 45%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11840648 Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material Emi MIYAZAWA, Takashi Kawamori, Shinichiro Sukata, Yoshihito Inaba, Keisuke NISHIDO 2023-12-12