KH

Keichi HORI

RE Resonac: 1 patents #29 of 157Top 20%
Overall (2023): #369,294 of 537,848Top 70%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11854919 Sealing composition and semiconductor device Dongchul KANG, Takahiro Horie, Kenta ISHIBASHI, Naoki Namai, Kazuhide Sekiguchi 2023-12-26