HK

Hideharu Kobashi

FC Fasford Technology Co.: 1 patents #1 of 10Top 10%
📍 Minami-Alps, JP: #5 of 11 inventorsTop 50%
Overall (2023): #424,773 of 537,848Top 80%
1
Patents 2023

Issued Patents 2023

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11692947 Die bonding apparatus and manufacturing method for semiconductor device Yuta Ono, Koji Hosaka, Masaaki Yoshiyama 2023-07-04