Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778731 | Systems and methods for break out of interconnections for high-density integrated circuit packages on a multi-layer printed circuit board | Thanh T. Tran, David G. Haedge, Paul Ingerson | 2023-10-03 |