Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817378 | Apparatus and method for providing a scalable ball grid array (BGA) assignment and a PCB circuit trace breakout pattern for RF chip interfaces | Nelly Chen, Gary Yao Zhang, Michael Randy May, Shrinivas Gopalan Uppili | 2023-11-14 |