Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605571 | Package comprising a substrate, an integrated device, and an encapsulation layer with undercut | Andreas Franz, Anna Katharina KREFFT, Claus Reitlinger | 2023-03-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11605571 | Package comprising a substrate, an integrated device, and an encapsulation layer with undercut | Andreas Franz, Anna Katharina KREFFT, Claus Reitlinger | 2023-03-14 |