Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817326 | Precision reconstruction for panel-level packaging | Amlan Sen, Chian Soon Chua, Wai Hoe Lee | 2023-11-14 |
| 11552043 | Post bond inspection of devices for panel packaging | Amlan Sen, Chian Soon Chua, Wai Hoe Lee | 2023-01-10 |