Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670622 | Stacked semiconductor package and packaging method thereof | Chia-Hung Lin, Fu-Yuan Yao, Chun-Wu Liu | 2023-06-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670622 | Stacked semiconductor package and packaging method thereof | Chia-Hung Lin, Fu-Yuan Yao, Chun-Wu Liu | 2023-06-06 |