Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11731413 | Attaching device and intermediate mechanism thereof, and attaching method | Yen-Dao Lee, Chun-Chieh Lu | 2023-08-22 |
| 11658046 | Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof | Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu, Ting-Yeh Wu | 2023-05-23 |
| 11587808 | Chip carrier device | Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu, Ying Chen, Ting-Yeh Wu | 2023-02-21 |