Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658046 | Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereof | Shih-Chun Chen, Kun-Chi Hsu, Chin-Ta Wu, Ting-Yeh Wu | 2023-05-23 |
| 11587808 | Chip carrier device | Shih-Chun Chen, Kun-Chi Hsu, Chin-Ta Wu, Ying Chen, Ting-Yeh Wu | 2023-02-21 |