Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11697864 | Copper alloy strip having high heat resistance and thermal dissipation properties | Min Jae Jeong, Hye Min Hong | 2023-07-11 |
| 11692243 | Free-cutting leadless copper alloy with no lead and bismuth | Bo Min Jeon, Won Seok JEONG | 2023-07-04 |