Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11542606 | Method of tin-plating copper alloy for electric or electronic parts and automobile parts and tin-plating material of copper alloy manufactured therefrom | Cheol Min Park, Buem Jae Lee, Hyo Young Kim | 2023-01-03 |