Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11740407 | Etched facet coupling for flip-chip to photonics chip bonding | Sajan Shrestha | 2023-08-29 |
| 11573372 | Methods for optical dielectric waveguide structures | Suresh Venkatesan | 2023-02-07 |
| 11543588 | Optical dielectric planar waveguide process | Miroslaw Florjanczyk, Suresh Venkatesan | 2023-01-03 |