Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848254 | Method for manufacturing a semiconductor package having a conductive pad with an anchor flange | CHI-HSUEH LI | 2023-12-19 |
| 11664345 | Semiconductor package element | Chih-Hung Chang, CHI-HSUEH LI | 2023-05-30 |
| 11594425 | Semiconductor package structure and fabricating method of the same | CHI-HSUEH LI | 2023-02-28 |
| 11562947 | Semiconductor package having a conductive pad with an anchor flange | CHI-HSUEH LI | 2023-01-24 |