Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11820105 | Prepreg, metal-clad laminate, and wiring board | Mikio Sato, Hiroaki Fujiwara, Masashi Koda, Yasunori HOSHINO | 2023-11-21 |
| 11770904 | Surface-treated copper foil, and copper-clad laminate plate, resin-attached copper foil and circuit board each using same | Takeshi Okamoto | 2023-09-26 |