Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11659284 | Information communication method | Mitsuaki Oshima, Koji Nakanishi, Hideki Aoyama, Ikuo Fuchigami, Hidehiko Shin +3 more | 2023-05-23 |
| 11602089 | High-frequency module | Yoshihito Otsubo | 2023-03-07 |
| 11553592 | Ceramic substrate and electronic component-embedded module | Ryota Asai | 2023-01-10 |