Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11674032 | Encapsulation resin composition, laminated sheet, cured product, semiconductor device, and method for fabricating semiconductor device | Shigeru Yamatsu, Kazuki Watanabe | 2023-06-13 |