Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11818835 | Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil | Hiroaki Takahashi, Masaya Koyama, Jun Tochihira, Ryu Harada | 2023-11-14 |