Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830962 | Method for structuring an insulating layer on a semiconductor wafer | Benjamin HAGEDORN | 2023-11-28 |
| 11626531 | Semiconductor body and method for producing a semiconductor body | Massimo Drago, Joachim Hertkorn, Ingrid Koslow | 2023-04-11 |
| 11594515 | Method of manufacturing a bonded substrate stack | Alfred Sigl | 2023-02-28 |