Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11745287 | Metal material solid-phase bonding method and solid-phase bonding device | Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki, Masayoshi Kamai | 2023-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11745287 | Metal material solid-phase bonding method and solid-phase bonding device | Hidetoshi Fujii, Yoshiaki Morisada, Yasuhiro Aoki, Masayoshi Kamai | 2023-09-05 |