Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11643554 | Composite resin granules and method for producing the same, and thermally conductive resin molded body using composite resin granules and method for producing thermally conductive resin molded body | Yuichi TOMINAGA, Yusuke Imai, Yuji Hotta, Setsuo Kikuchi, Makoto Iwai +1 more | 2023-05-09 |