Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721586 | Method and system for regulating plasma dicing rates | Ernst Eiper, Johannes Cobussen, Chantal Claude Dijkstra | 2023-08-08 |
| 11658056 | Technique for handling diced wafers of integrated circuits | Johannes Cobussen | 2023-05-23 |